Nick Cheng

Nick joined Edison’s team in March of 2022. Before joining Jefferies, Nick started his career as an IC Physical Design Engineer and Advanced Chip Design Consultant with TSMC, working with top clients such as Apple, MTK and Huawei on their advanced node IC design process, and with top EDA players like Synopsys and Cadence to develop EDA tools. After that, he spent three years in mainland China and working on a Harvard-med spin-off wearable startup before we went for MBA.
Nick obtained his B.Eng degree (First Honors) in Electrical Engineering at Hong Kong University of Science and Technology, and an MBA (finance and private equity dual concentration) at London Business School.

What I am Known For

• In-depth understanding of technology hardware and semiconductor industry
• Deep and differentiated understanding of TSMC, its technologies and latest development of advanced-node-products
• Wide range of resources in semiconductor industry and Taiwan to monitor the supply chain dynamics
• Quick understanding of cutting-edge semiconductor technologies and latest development with engineer’s knowledge background
• Strong connection in the industry to help arrange bespoke meetings

How I am Different

• Understanding and analyzing semiconductor sector from a very engineer viewpoint
• Providing detailed technology teach-in that help investors understand industry dynamics
• Market leader in analyzing AI and related IC design technology trend

Corporate & Strategic Access

• Pre-JAF China tech tour in Beijing/Shanghai/Shenzhen
• China semiconductor equipment tour in Wuxi
• Multiple 1×1/group NDR for covered/uncovered tech names